Technology Roadmap
Equipment List
Quality Manual
DOMESTIC
RIGID TECHNICAL CAPABILITIES SUMMARY
SPECIAL EQUIPMENT:
·
CAD/CAM (DRC &
DFM)- Includes 3 stations – Barco Cam Software (includes Laser
Plotter).
·
Impedance
(TDR) Testing (See Electrical Test Methods)
·
Hi-Pot (High
VAC & VDC) Testing, Insulation Resistance Testing (See Electrical
Test Methods)
·
Plasma &
Permanganate Resin Desmear plus Etchback Processes (QML-31032- MIL
Certified).
·
Automated
Optical Inspection (AOI) for Photo-tooling & Inner Layers.
·
Vacuum &/or
Hydraulic Presses for Multilayer Laminating & Heatsink Bonding.
·
Scoring/V-Groove- Standard & Skip Score with controlled web
thickness (Provide a .015 minimum/preferred .020 clearance (Keep-out
Area) from edge of board to any conductive feature).
SCREENING AND SOLDERMASKS:
·
Carbon
Conductive Ink
·
Screened
Legends (Thermal & LPI-Various Colors)
·
Via
Protection– Cover/Tent, Plug, or Fill
·
Liquid Photo-Imageable
(LPI) Solder Mask (typical thickness=.001-2 wet-as applied & .0003
(at conductor knee) -.0008 (on conductor surface) dry-minimum after
cure). Min Dam Width=.003 in.008 space. Minimum Dam Width
Registration +/-.0025".
TYPES OF PLATING & FINISHES
(ALL FOR MIL APPLICATIONS @ CERTIFIED CONTROLLED THICKNESSES:
·
Deep
Nickel/Gold Plating (NiAu) Pre-Etch or Post-Etch (requires tie lines
& tie bars) or Nickel/Gold Tabs (Type II, Grade C)
·
Copper Edge
Plating with HASL, ENIG or IS Finish
·
Pattern
Plating Acid Copper (Cu) Typically .001” thick in the hole & .0012”
on the surface (see details below)
·
ENIG=
Electroless Nickel (Ni) / Immersion Gold (Au)
·
IS= Immersion
Silver (Ag)
·
HASL= Vertical
and Horizontal Hot Air Solder Leveling (typical solder
thickness .0001 for flat SMD pads)
·
HAL= Hot Air
Leveled (Lead-Free Solder)
TECHNOLOGY &
TOLERANCES (SEE DOMESTIC TECHNOLOGY ROADMAP FOR MORE INFORMATION):
·
Drilled Hole
Size (DHS): Smallest= .0079” (20mm);
Largest= .2559” (6.50mm).
Larger sized holes are routed.
·
Finished Hole
Size (FHS): Smallest with plating </=.005
·
Hole Location:
1st : to Datum .003" TIR (Total
Indicated Run-out).
DTP
(Dia about True Pos) Lev. A=.010, Lev. B=.008, Lev. C=.006
·
Conductor
(Line/Trace) Width & Space:
Minimum Conductors
.004" Minimum
Spacing based on .004 Conductor
.004"@Half oz.
Cu.; .006"@ 1oz. Cu); .009@2 oz. cu. Special- Any widths narrower or starting with
thicker copper foils than shown here.
Important: Unless advised otherwise, we may modify all or some
conductive features for etch allowance (adding typically .001/side
of conductor per oz of foil) to provide
conductor
widths &/or spaces as may be specified or
to replicate design features.
·
Aspect Ratio:
Level C=9:1 & up
·
Thru Hole
Copper Plating Thickness: Minimum =.0008, Typical Average =.001;
Higher Depositions As Specified.
·
Minimum Land
Requirement for 1-oz Cu & </= 8-layers is maximum drill diameter + 2
minimum annular rings + .010 (Level B)
·
Dimensional
Tolerances for Finished Piece/Array: Typical Routed +/- .005; Scored
+/- .010; Tighter Tolerances upon Request.
·
Photo-tool
Registration Tolerance, Front to Back:
Standard +/- .003; Tighter Tolerances upon Request.
·
Thickness
Tolerance (Laminate/Material/Overall):
Standard = .032 +/-
.005; .062 +/- .006; .093 +/- .009;
Special
= any tolerance < standard (as determined by board specifics).
Note: For thin
laminate (cores) thicknesses are for dielectric only (foil is added
on).
·
Copper Foil
Weight (to be specified for all one-sided PCB’s & all inner layers):
Minimum thickness
(after processing);
Standard
1/2 ounce (.0005 thk), 1 ounce (.0010 thk) & 2 ounce (.0022 thk)
(QML-31032- up to 2-oz). Note: Nominal thickness for 1 oz. foil is
.00135 before processing. All other copper foil weights ( <1/2 ounce
- > 2 ounce) are considered Special.
·
Copper Surface
Thickness
after plating (to be
specified as the total copper thickness for all two sided &
multilayer outer layers). Processing for thru-hole plating will
typically remove a minimum of .0002 of the starting copper foil wt.
Pattern Thru-hole Plating will typically deposit .001 of copper in
the hole & .0012 of copper on the surface. Specification call out
should be for
total surface copper thickness
minimum
of .0013 (1/2 oz base) or .0018 (1 oz base) or .003 (2 oz base) or
.0042 (3 oz base) on external conductors with a tolerance total of
conductor width and/or thickness reduction due to imperfections
equaling 20% maximum for Class 2 and 3 or 30% maximum for Class 1.
Designs should also account for conductor width tolerances based on
starting foil weight and Design Levels A, B or C (Note: Philway has
High Technology Capability to Design Level C applications).
·
Bow and Twist:
Standard 1.5%, SMT 0.75% Maximum.
MIL-PRF-31032 Capabilities Include: GF, GI
& GM Base Materials with .005 Conductor & Spacing Widths. Up to 15
Layer Construction for all listed Base Material Types (Higher layer
counts are available). Note: See DSCC Website for complete QML
Capabilities Listing.
Form 30-08C
Dated 11/17/08 For most recent version of this document, go to
Philway Products Web Site: www.Philway.com